ESD Bag for Electronic Used
LTLD ESD CO., LTD.- Making Process：Composite Packaging Bag
- Shape：Plastic Bags
- Material：PP
- Feature：Moisture Proof, Antistatic
- Application：Household, Electronic
- Raw Materials：High Pressure Polyethylene Plastic Bag
Base Info
- HS Code：3923290000
- Origin：China
- Trademark：LTLD
- Transport Package：Carton
- Thickness：0.08-0.16mm
- Bag Variety：Back Seal Bags
- Production Capacity：1000000PCS,Year
Description
Performance of
Anti-static1x105Ω<resistance of outer surface<1x109Ω
1x105Ω<resistance of internal surface<1x1011Ω
Metal layer<1x100Ω ANSI/ESD STM 11.1 Friction voltage: <100V ESD ADV 11.2 2 Electrostatic shielding Remanent shield voltage: <20V EIA 541 3 EMI Attenuation >60 dB MIL-PRF-81705 4 Life time After using 1 year, still meet the requirements of No. 2/3/4 MIL-PRF-81705 5 Structure PET/ AL/ NY/ PE 6 Thickness > 0.14 mm 7 Size Refer to drawing's marks 8 Heat-seal strength > 30N/ 15mm 9 Tensile strength (vertical and horizontal direction) Vertical >75N/ 15mm
Horizontal >85N/ 15mm 10 Heat-seal condition Temperature: 300-400F
Time: 0.6-4.5 seconds
Pressure: 30-70 PSI 11 Peel strength >3.0N/ 15mm 12 Puncture resistance >100N MIL-STD-3010 13 Water vapor permeance J-STD-033 0.002mg/100 in2 /24h ASTM F 1249-13
Application:
Mainly applicable to all kinds of packing of PC Board, electronic components, modems, CD-Rom, etc.
Anti-static
1x105Ω<resistance of internal surface<1x1011Ω
Metal layer<1x100Ω
Horizontal >85N/ 15mm
Time: 0.6-4.5 seconds
Pressure: 30-70 PSI
Application:
Mainly applicable to all kinds of packing of PC Board, electronic components, modems, CD-Rom, etc.