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ESD Shielding Plastic Packaging Bag for Electronic Component

Suzhou Sky Industrial Co., Ltd.
  • Making Process：Composite Packaging Bag
  • Shape：Open Top, Zip Lock, Gusset Bag
  • Material：Laminated Material
  • Feature：Moisture Proof, Antistatic
  • Application：PC Board, IC, CD Driver, HD Pack
  • Raw Materials：APET,PE APET,CPP

Base Info

  • Specification：SGS ROHS report
  • Transport Package：50 - 100PCS Per Bag, 5 - 50 Bags , Carton
  • Bag Type：Open Top, Zip Lock
  • Surface Handling：Gravure Printing
  • Color：Semi-Transparent
  • Industrial Use：Electronic Components, Semiconductive Industry
  • Function：Anti Static
  • Bag Variety：Open Top Bag, Zip Lock Bag
  • Model NO.：SZ-S001
  • Trademark：DIASAP
  • Origin：Suzhou, China
  • HS Code：3923210000
  • Production Capacity：200000 PCS,Day

Description

Product Description:Product NameESD Shielding Plastic Packaging Bag for Electronic Component Material StructureLayers Laminated Materials
PET-AL/PE            PET-AL/CPPFeatureAnti-static, moisture barrierPrintingcustomizedSurface Resistance10^6~10^11 OhmThicknessCustomizedBag StyleOpen top/zip lockPackage50~100pcs per bag and then in cartons or as per customer's requestUsageElectronic products which are sensitive to static, such as PC board, IC integrated circuit ,CD driver, HD packaging. 
Technical Parameters:
NO.ItemStandardResult
1Surface resistivityASTM D-25710^6-10^11ohm
2Decay time IEC61340-5-1<0.3s
3Light Transmission RateASTM D-100340%±5%
4Heat-Seal Temperature 150%±10%
5Heat-Seal Pressure 50Pa
6Heat-Seal Time ≤1S

 Product Picture:

ESD Shielding Plastic Packaging Bag for Electronic Component
ESD Shielding Plastic Packaging Bag for Electronic ComponentESD Shielding Plastic Packaging Bag for Electronic ComponentESD Shielding Plastic Packaging Bag for Electronic ComponentESD Shielding Plastic Packaging Bag for Electronic Component

Factory Show:
ESD Shielding Plastic Packaging Bag for Electronic Component

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Free samples will be sent for your evaluation!